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  features  trenchfet  power mosfet  100% r g tested si3552dv vishay siliconix document number: 70971 s-31725?rev. b, 18-aug-03 www.vishay.com 1 n- and p-channel 30-v (d-s) mosfet product summary v ds (v) r ds(on) (  ) i d (a) n-channel 30 0.105 @ v gs = 10 v 2.5 n - ch anne l 30 0.175 @ v gs = 4.5 v 2.0 p channel 30 0.200 @ v gs = - 10 v - 1.8 p-channel -30 0.360 @ v gs = - 4.5 v - 1.2 d 1 g 1 s 1 n-channel mosfet s 2 g 2 d 2 p-channel mosfet tsop-6 top view 6 4 1 2 3 5 2.85 mm 3 mm d2 g2 s1 s2 d1 g1 ordering information: si3552dv-t1 absolute maximum ratings (t a = 25  c unless otherwise noted) parameter symbol n-channel p-channel unit drain-source voltage v ds 30 -30 v gate-source voltage v gs  20  20 v continuous drain current (t j = 150  c) a b t a = 25  c i d 2.5 - 1.8 continuous drain current (t j = 150  c) a, b t a = 70  c i d 2.0 - 1.2 a pulsed drain current i dm 8 -7 a continuous source current (diode conduction) a, b i s 1.05 - 1.05 maximum power dissipation a b t a = 25  c p d 1.15 w maximum power dissipation a, b t a = 70  c p d 0.73 w operating junction and storage temperature range t j , t stg - 55 to 150  c thermal resistance ratings parameter symbol typical maximum unit mi j ti tabit a t  5 sec r 93 110 maximum junction-to-ambient a steady state r thja 130 150  c/w maximum junction-to-lead steady state r thjl 75 90 c/w notes a. surface mounted on fr4 board. b. t  5 sec
si3552dv vishay siliconix www.vishay.com 2 document number: 70971 s-31725?rev. b, 18-aug-03 specifications (t j = 25  c unless otherwise noted) parameter symbol test condition min typ max unit static gate threshold voltage v gs(th) v ds = v gs , i d = 250  a n-ch 1.0 v g ate th res h o ld v o l tage v gs(th) v ds = v gs , i d = - 250  a p-ch - 1.0 v gate body leakage i gss v ds = 0 v v gs =  20 v n-ch  100 na gate-body leakage i gss v ds = 0 v, v gs =  20 v p-ch  100 na v ds = 24 v, v gs = 0 v n-ch 1 zero gate voltage drain current i dss v ds = - 24 v, v gs = 0 v p-ch -1  a zero gate voltage drain current i dss v ds = 24 v, v gs = 0 v, t j = 55  c n-ch 5  a v ds = - 24 v, v gs = 0 v, t j = 55  c p-ch -5 on state drain current a i d( ) v ds = 5 v, v gs = 10 v n-ch 5 a on-state drain current a i d(on) v ds = - 5 v, v gs = - 10 v p-ch -5 a v gs = 10 v, i d = 2.5 a n-ch 0.085 0.105 drain source on state resistance a r ds( ) v gs = - 10 v, i d = - 1.8 a p-ch 0.165 0.200  drain-source on-state resistance a r ds(on) v gs = 4.5 v, i d = 2.0 a n-ch 0.140 0.175  v gs = - 4.5 v, i d = - 1.2 a p-ch 0.298 0.360 forward transconductance a g f v ds = 10 v, i d = 2.5 a n-ch 4.3 s forward transconductance a g fs v ds = - 15 v, i d = - 1.8 a p-ch 2.4 s diode forward voltage a v sd i s = 1.05 a, v gs = 0 v n-ch 0.81 1.10 v diode forward voltage a v sd i s = - 1.05 a, v gs = 0 v p-ch - 0.83 - 1.10 v dynamic b total gate charge q g n-ch 2.1 3.2 t ota l g ate ch arge q g n-channel p-ch 2.4 3.6 gate source charge q n - channel v ds = 15 v, v gs = 5 v, i d = 1.8 a n-ch 0.7 nc gate-source charge q gs p-channel v 15 v v 5 v i 18 a p-ch 0.9 n c gate drain charge q d v ds = - 15 v, v gs = - 5 v, i d = - 1.8 a n-ch 0.7 gate-drain charge q gd p-ch 0.8 gate resistance r n-ch 0.5 2.4  gate resistance r g p-ch 3 11  turn on delay time t d( ) n-ch 7 11 turn-on delay time t d(on) p-ch 8 12 rise time t n-channel v dd = 15 v, r l = 15  n-ch 9 14 rise time t r v dd = 15 v , r l = 15  i d  1 a, v gen = 10 v, r g = 6  p-ch 12 18 turn off delay time t d( ff) p-channel v 1 v r 1  n-ch 13 20 ns turn-off delay time t d(off) p channel v dd = - 15 v, r l = 15  i d  -1 a , v gen = - 10 v , r g = 6  p-ch 12 18 ns fall time t f i d  - 1 a , v gen = - 10 v , r g = 6  n-ch 5 8 fall time t f p-ch 7 11 source-drain t i f = 1.05 a, di/dt = 100 a/  s n-ch 35 60 source-drain reverse recovery time t rr i f = - 1.05 a, di/dt = 100 a/  s p-ch 30 60 notes a. pulse test; pulse width  300  s, duty cycle  2%. b. guaranteed by design, not subject to production testing.
si3552dv vishay siliconix document number: 70971 s-31725?rev. b, 18-aug-03 www.vishay.com 3 typical characteristics (25  c unless noted) nchannel - on-resistance ( 0 2 4 6 8 10 0123456 0 2 4 6 8 10 012345 0 2 4 6 8 10 01234 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 - 50 - 25 0 25 50 75 100 125 150 0.00 0.05 0.10 0.15 0.20 0.25 01234567 0 50 100 150 200 250 300 0 5 10 15 20 25 30 output characteristics transfer characteristics gate charge on-resistance vs. drain current v ds - drain-to-source voltage (v) - drain current (a) i d v gs = 10 thru 5 v v gs - gate-to-source voltage (v) - drain current (a) i d 25  c t c = - 55  c - gate-to-source voltage (v) q g - total gate charge (nc) v ds - drain-to-source voltage (v) c - capacitance (pf) v gs c rss c oss c iss r ds(on)  ) i d - drain current (a) capacitance on-resistance vs. junction t emperature t j - junction temperature (  c) (normalized) - on-resistance ( r ds(on)  ) v gs = 10 v v gs = 4.5 v 4 v 3 v 125  c v ds = 15 v i d = 1.8 a v gs = 10 v i d = 2.5 a 2v
si3552dv vishay siliconix www.vishay.com 4 document number: 70971 s-31725?rev. b, 18-aug-03 typical characteristics (25  c unless noted) nchannel 0.01 0 1 6 8 2 4 10 30 0.1 power (w) single pulse power (junction-to-ambient) time (sec) - 0.8 - 0.6 - 0.4 - 0.2 - 0.0 0.2 0.4 - 50 - 25 0 25 50 75 100 125 150 i d = 250  a 1.0 1.2 0.00 0.08 0.16 0.24 0.32 0.40 0246810 0.1 1 10 i d = 2.5 a 0.00 0.2 0.4 0.6 0.8 t j = 25  c t j = 150  c threshold v oltage variance (v) v gs(th) t j - temperature (  c) source-drain diode forward v oltage on-resistance vs. gate-to-source voltage - on-resistance ( r ds(on)  ) v sd - source-to-drain voltage (v) v gs - gate-to-source voltage (v) - source current (a) i s normalized thermal transient impedance, junction-to-ambient square wave pulse duration (sec) normalized effective transient thermal impedance 2 1 0.1 0.01 10 -3 10 -2 1 10 600 10 -1 10 -4 duty cycle = 0.5 0.2 0.1 0.05 0.02 single pulse 100 1. duty cycle, d = 2. per unit base = r thja = 130  c/w 3. t jm - t a = p dm z thja (t) t 1 t 2 t 1 t 2 notes: 4. surface mounted p dm i d = 2 a
si3552dv vishay siliconix document number: 70971 s-31725?rev. b, 18-aug-03 www.vishay.com 5 typical characteristics (25  c unless noted) nchannel 10 -3 10 -2 110 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single pulse duty cycle = 0.5 normalized thermal transient impedance, junction-to-foot square wave pulse duration (sec) normalized effective transient thermal impedance typical characteristics (25  c unless noted) pchannel 0 2 4 6 8 10 012345 0.0 0.1 0.2 0.3 0.4 0.5 0.6 01234567 0 60 120 180 240 300 0 6 12 18 24 30 0 2 4 6 8 0123456 output characteristics transfer characteristics on-resistance vs. drain current v ds - drain-to-source voltage (v) - drain current (a) i d v gs - gate-to-source voltage (v) - drain current (a) i d v ds - drain-to-source voltage (v) c - capacitance (pf) - on-resistance ( r ds(on)  ) i d - drain current (a) capacitance v gs = 10 thru 7 v 2 v t c = - 55  c 125  c v gs = 10 v v gs = 4.5 v c rss c oss c iss 3 v 4 v 5 v 6 v 25  c
si3552dv vishay siliconix www.vishay.com 6 document number: 70971 s-31725?rev. b, 18-aug-03 typical characteristics (25  c unless noted) pchannel 1.2 1.5 0.1 1 10 0.00 0.3 0.6 0.9 t j = 25  c t j = 150  c source-drain diode forward voltage v sd - source-to-drain voltage (v) - source current (a) i s - 0.4 - 0.2 0.0 0.2 0.4 0.6 - 50 - 25 0 25 50 75 100 125 150 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0246810 v gs - gate-to-source voltage (v) 0 2 4 6 8 10 012345 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 - 50 - 25 0 25 50 75 100 125 150 gate charge - gate-to-source voltage (v) q g - total gate charge (nc) v gs on-resistance vs. junction t emperature v gs = 10 v i d = 1.8 a t j - junction temperature (  c) (normalized) - on-resistance ( r ds(on)  ) on-resistance vs. gate-to-source voltage threshold v oltage - on-resistance ( r ds(on)  ) t j - temperature (  c) i d = 250  a variance (v) v gs(th) v ds = 15 v i d = 1.8 a i d = 1.8 a i d = 1 a 0.01 0 1 6 8 2 4 10 30 0.1 power (w) single pulse power (junction-to-ambient) time (sec)
si3552dv vishay siliconix document number: 70971 s-31725?rev. b, 18-aug-03 www.vishay.com 7 typical characteristics (25  c unless noted) pchannel 10 -3 10 -2 110 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single pulse duty cycle = 0.5 normalized thermal transient impedance, junction-to-foot square wave pulse duration (sec) normalized effective transient thermal impedance normalized thermal transient impedance, junction-to-ambient square wave pulse duration (sec) normalized effective transient thermal impedance 2 1 0.1 0.01 10 -3 10 -2 1 10 600 10 -1 10 -4 duty cycle = 0.5 0.2 0.1 0.05 0.02 single pulse 100 1. duty cycle, d = 2. per unit base = r thja = 130  c/w 3. t jm - t a = p dm z thja (t) t 1 t 2 t 1 t 2 notes: 4. surface mounted p dm
legal disclaimer notice vishay document number: 91000 www.vishay.com revision: 08-apr-05 1 notice specifications of the products displayed herein are subjec t to change without notice. vishay intertechnology, inc., or anyone on its behalf, assume s no responsibility or liability fo r any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. except as provided in vishay's terms and conditions of sale for such products, vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and /or use of vishay products including liab ility or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyrigh t, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify vishay for any damages resulting from such improper use or sale.


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